SK Hynix weighs Intel for HBM4E base dies, Herald Economy reports

SK Hynix is weighing Intel as a supplier of base dies for HBM4E, its next-generation high-bandwidth memory. No details are available on qualification status, production volumes, pricing, or when any supply agreement could begin.

The possible pairing would extend beyond Intel's traditional role as a processor maker. HBM packages use a base die to connect stacked memory chips with the wider computing system, making manufacturing quality and advanced packaging important parts of the supply chain. Intel is under consideration for that component as demand for high-bandwidth memory remains linked to accelerated computing.

For Intel, a successful engagement could create work for its manufacturing operations and add a new customer relationship to its foundry strategy. The company reported FY 2025 revenue of $52.9B, down 0.5% YoY, with gross margins of 34.8% and a net margin of -0.5%; an HBM4E base-die program would therefore be relevant mainly as a potential future manufacturing win rather than an immediately material change to reported results. For SK Hynix, the connection would be a possible additional source of base-die capacity or technology.

The central uncertainty is that this is a reported consideration, not a confirmed award. No contract, purchase commitment, manufacturing node, or timetable has been identified. It is also unclear whether Intel would supply the dies through its own manufacturing operations, provide another form of technology support, or merely remain one candidate among several.

Future confirmation would need to come from SK Hynix or Intel through a company statement, filing, earnings call, or other disclosure identifying the relationship. Investors would also need evidence of qualification, expected volumes, pricing, and the timing of revenue recognition before the opportunity could be assessed against Intel's current financial base.